Job Description:
Position Overview:
Located in Breinigsville, PA, our high volume, 24/7 manufacturing facility produces products to enable fiber optic communication expansion. As a Wafer Fab Process Engineer, you will develop, improve and sustain wafer fab processes including photolithography, dry etch, wet etch and thin film deposition processes for Indium Phosphide laser and detector device manufacturing. You will be responsible for installing robust equipment and process solutions through rigorous characterization and statistical validation before ramping them into high-volume manufacturing.
Responsibilities:
- Developing, improving, and sustaining wafer fab processes including photolithography, RIE/ICP dry etch, wet etch and thin film deposition processes for high volume photonic integrated circuit manufacturing.
- Conducting data analysis, failure analysis, and yield improvement
- Conduct design of experiments, lead/take ownership of projects to develop/qualify new processes and tools, and complete projects on time and within budget
- Maintaining or defining process standard operating procedures, providing instructions to operators for wafer processing
- Maintaining or defining quality management standard including creating and reviewing SPC charts for robust quality control
- Maintain a working knowledge of safety policies and regulations to ensure duties of self and others are performed in a safe manner
- Collaborate with peers and process engineering/maintenance teams to define project scope, objectives, schedules, and resource requirements.
- Lead and manage long-term improvement projects to ensure timely execution and alignment with organizational goals.
Qualifications and skills:
- Bachelors in Physics, Electrical/Chemical/Material/Mechanical engineering with 8+ years of related experience; Masters with 6+ years of related experience; or PhD with 3+ years of related industry experience.
- Hands-on semiconductor wafer fabrication experience, preferably from a InP semiconductor production environment or compound semiconductor manufacturing environment
- Direct experience in RIE/ICP, wet chemistry, thin film deposition, photolithography
- Familiar with material & process characterization methods
- Hands on SEM/EDS experience a plus
- Experience in using SPC, DOE and Lean manufacturing methods, JMP experience a plus.
- Strong problem solving, teamwork, and communication skills
- Being able to work outside of normal business hours when needed
- Strong background in scaling high-volume manufacturing and implementing automation solutions.
Additional Job Description:
Compensation And Benefits
The annual base salary range for this position is $108,000 - $172,800.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
R024655